Electronics & Data Centers
High-density computing readiness
Ensuring peak performance of high-density computing systems with advanced liquid cooling, air cooling, and thermal interface materials.
Rack-Level CoolingHeat exchangers, cold plates, and manifolds for dense racks.
TIM Stack-UpsMaterials tuned for throughput and reliability.
EMI & SealingProtection for enclosures and sensitive electronics.
What we deliver
- Rack-level liquid cooling, heat exchangers, and vapor chambers
- Thermal interface materials tuned for performance
- EMI shielding and precision sealing for enclosures
Applications
- Hyperscale and enterprise data centers
- Edge computing and telecom infrastructure
- Industrial and automation controllers
Program approach
Thermal simulation, lab validation, and rapid prototyping aligned to deployment schedules. Designed for uptime and serviceability.
Ready to increase thermal headroom?
Partner with Boyd to unlock reliable performance in high-density computing.