Thermal Interface Materials
Optimize conductivity, pressure, and reliability
Advanced materials that enhance heat transfer between components—critical for managing thermal performance in electronics and high-power systems.
Material RangeGap fillers, pads, greases, and phase-change materials tuned to your surfaces.
Precision FormatDie-cut, kiss-cut, and custom thickness control for tight tolerances.
Co-DesignTIMs paired with mechanical and liquid/air systems for balanced pressure.
Material capabilities
- Gap fillers engineered for high conductivity and compression
- Thermal pads and phase-change materials for stable contact
- Greases and gels for serviceable designs
- Electrically insulating and EMI shielding options
Integration discipline
We balance conductivity with mechanical pressure, surface flatness, and manufacturability. TIM performance is validated with thermal simulation and real-world testing.
- Surface prep and compression control for long-term stability
- Compatibility with heat sinks, cold plates, and vapor chambers
- Precision dispensing and automated placement support
Applications
- Power electronics and inverters
- Battery modules and energy storage
- Data center servers and edge devices
- Aerospace and defense electronics
Ready to select the right TIM?
Partner with Boyd to specify materials, formats, and assembly processes that keep your system cool and reliable.